In the field of high-end equipment manufacturing, the perpendicularity error of stainless steel plate
exceeds 0.15mm may trigger a chain reaction - precision instrument assembly stall, building curtain
wall sealing failure, medical equipment components vibration exceeds the standard ...... These tiny
deviations that are difficult to distinguish with the naked eye, are forcing the manufacturing industry
to build a more quality control system. The manufacturing industry is being forced to build a more
stringent quality control system. This article will analyze the verticality control of the five key technical
nodes, revealing how the whole process management to enhance the product qualification rate to
99.6% or more.
Intelligent detection: to the steel plate equipped with “millimeter ruler”.
Modern industrial inspection has broken through the limitations of the traditional caliper, an intelligent factory practice
data show: the use of laser 3D scanning + AI analysis system, the detection efficiency increased by 400%, a single
day can be completed 2000 square meters of automatic determination of the plate.
Core detection technology matrix:
Laser displacement sensor array: 12 groups of sensors synchronized scanning, 0.03mm repeatable measurement accuracy
Dynamic compensation algorithm: automatically eliminate the measurement error caused by environmental vibration
Digital twin comparison: real-time comparison and analysis of measured data and CAD models
Graded warning mechanism: set up yellow / orange / red three-level quality alarm thresholds
Process Traceability: Shift from Result Control to Process Prevention
Through process optimization, a processing company reduced the scrap rate due to perpendicularity problems from 2.7% to
0.3%. Key control points include:
1. Rolling process regulation and control
Temperature gradient control: keep the temperature difference between rolls ≤ 8°C
Stress balancing system: Dynamically compensating the residual stress inside the plate
Adaptive rolling speed: automatically matching the optimal parameters according to the plate thickness.
2. Heat treatment process innovation
Gradient cooling technology: solving the edge warping caused by traditional quenching.
Magnetic field-assisted annealing: eliminates microscopic lattice distortion.
Temperature field modeling: Establish thickness-temperature-deformation prediction model.
Closed-loop management of the whole process: creating a
quality firewall
The practice of a demonstration project shows that after the implementation of PDCA cycle management, the
quality problem tracing time is shortened by 83%, and the process improvement cycle is compressed by 60%.
Four-dimensional model of quality control:
Raw material pre-screening: establish a database of supplier sheet flatness
Process monitoring: 22 key processes set up quality collection points
Equipment interlocking: automatically triggering process parameter adjustment in case of over-deficiency
Knowledge Precipitation: Establish defect characteristics - process parameters correlation mapping
Technology Iteration: Embracing the era of micron-level precision
With the semiconductor equipment, aerospace and other areas of the plate precision requirements to break
through the 0.05mm threshold, the industry is promoting three major technology upgrades:
Quantum measurement technology: nanoscale deformation detection based on atomic interference
Intelligent leveling system: dynamic correction platform equipped with 128 actuators
Digital twin platform: realizing real-time mapping of process parameters and product performance
Value transformation: from cost center to profit engine
The quality big data analysis of an enterprise shows that: every 1% increase in verticality pass rate can reduce
the annual quality cost by 1.2 million yuan, and bring the following benefits at the same time:
Processing efficiency improvement: reduce the rework labor time by 35%.
Reduction of material loss: reduce the waste of edge material by 22%.
Brand premium formation: 18% increase in conversion rate of high-end orders.
Conclusion: When the industry competition enters the “micron level” battlefield, quality control is no longer a
simple product screening, but a systematic project throughout the design, manufacturing and testing. Through
the construction of “detection - analysis - optimization” of the closed-loop ecology, enterprises can not only
guard the bottom line of quality, but also the process precision into a sharp weapon of market competition.
In the next three years, with the deep integration of industrial Internet of Things and machine vision
technology, the stainless steel processing field will usher in a new round of quality revolution.